Qualcomm is expected to announce its flagship Snapdragon 8 Gen 2 chipset at its annual summit to be held November 15-17, and we expect all major Android OEMs to take the devices with them soon after. A new set of specs leaked from tipster Stazzjon taċ-chat diġitali suggests we will see the next flagship chipset on the Honor Magic5.
The device will also reportedly feature a 6.8-inch high refresh rate curved display with PWM attenuation. In terms of cameras, Magic5 will bring a 50MP main shooter with AI ISP tuning. The flagship will also offer IP-68 rating for water and dust resistance and lightning-fast 100W wired and 50W wireless charging.
In the news related to the spec leaks, DCS also reports of a new foldable phone from Honor that is also expected to use the Snapdragon 8 Gen 2 chipset and 66W wired charging.
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